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US 12,246,398 B2Granted
Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump
AssigneeResonac Corporation
InventorsKunihiko Akai, Masayuki Miyaji, Junichi Kakehata, Yoshinori Ejiri
Life of this patent
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Abstract
A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H1, and a height of the solder particle is designated as H2, H1<H2 is established.
Claims8
A solder bump forming member comprising:
- a base substrate having a plurality of recesses;
- and
- a plurality of solder particles in the recesses, respectively, wherein;
- each of the solder particles has an average particle diameter of 1 to 35 μm and a C.V value of 20% or less;
- a part of each of the solder particles projects from the respective recess;
- and
- each of the solder particles includes a planar portion in contact with a bottom portion of the respective recess.
4 more elements
A solder bump forming member comprising:
- a base substrate having a plurality of recesses;
- and
- a plurality of solder particles in the recesses, wherein:
- each of the solder particles has an average particle diameter of 1 to 35 μm and a C.V value of 20% or less;
- in cross-sectional view, when a depth of each of the recesses is designated as H1, and a height of the solder particle is designated as H2, H1<H2 is established;
- and
- each of the solder particles includes a planar portion in contact with a bottom portion of the respective recess.
4 more elements
Dependencies are inferred from the claim text.