Method for forming wiring on semiconductor device

A method for forming wiring on a semiconductor device in which wiring is formed by transfer on a substrate through an imprinting method in which a replica mold created from a master mold is used, the method comprising:

• an electroconductive paste filling process step of filling recesses that are formed in the replica mold and that exhibit a prescribed pattern with an electroconductive paste containing a resin that is curable by ultraviolet rays, the ultraviolet-ray-curable-resin-containing electroconductive paste being such that an ultraviolet-ray-curable resin is incorporated into an electroconductive paste for which the average particle diameter of an electroconductive material is set to 0.1-20 μm, and is set to a range from ⅕ to 1/10 of the minimum line width of the wiring formed by transfer on the substrate, and the volumetric ratio of the electroconductive paste and the ultraviolet-ray-curable resin in the ultraviolet-ray-curable-resin-containing electroconductive paste is set to 6:4-8:2;
• a replica mold superposition process step of superposing the replica mold filled with the ultraviolet-ray-curable-resin-containing electroconductive paste on the substrate;
• an electroconductive paste curing process step for irradiating the ultraviolet-ray-curable-resin-containing electroconductive paste with ultraviolet rays in a state in which the replica mold is superposed on the substrate and curing the ultraviolet-ray-curable-resin-containing electroconductive paste;
• and
• an electroconductive paste transfer process step of separating the replica mold from the substrate, transferring the ultraviolet-ray-curable-resin-containing electroconductive paste to the substrate, and forming wiring having the prescribed pattern, the substrate is provided with an intermediate layer made of an active light-curing resin or a heat-effect resin that deforms under pressure on the conductive part, the intermediate layer is provided to an electroconductive element formation surface at which the electroconductive elements are to be formed, the replica mold superposition process step is a step of superposing the replica mold filled with conductive paste containing the ultraviolet-ray-curable-resin-containing electroconductive paste on the intermediate layer of the substrate, and pressure-bonding the replica mold to the intermediate layer by applying pressure, the electroconductive paste curing process step involving irradiating the ultraviolet-ray-curable-resin-containing electroconductive paste with the ultraviolet rays from the bottom side of the recesses in the replica mold, and curing only a contact interface portion at which the ultraviolet-ray-curable-resin-containing electroconductive paste contacts the recesses.