H05K 2203/0307
Providing micro- or nanometer scale roughness on a metal surface
Official title: Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
H05K2203/0307 (Providing micro- or nanometer scale roughness on a metal surface) appears on 413 US grants and 304 published applications in this corpus.
Search patents in H05K- Granted patents
- 413
- Published applications
- 304
- Assignees
- 160
- Inventors
- 814
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 9 | 0 |
| 1994 | 11 | 0 |
| 1995 | 7 | 0 |
| 1996 | 15 | 0 |
| 1997 | 11 | 0 |
| 1998 | 14 | 0 |
| 1999 | 18 | 0 |
| 2000 | 15 | 0 |
| 2001 | 22 | 15 |
| 2002 | 22 | 21 |
| 2003 | 17 | 17 |
| 2004 | 14 | 14 |
| 2005 | 10 | 12 |
| 2006 | 13 | 7 |
| 2007 | 9 | 18 |
| 2008 | 10 | 13 |
| 2009 | 5 | 14 |
| 2010 | 7 | 7 |
| 2011 | 11 | 4 |
| 2012 | 8 | 12 |
| 2013 | 5 | 11 |
| 2014 | 5 | 10 |
| 2015 | 9 | 16 |
| 2016 | 10 | 16 |
| 2017 | 9 | 9 |
| 2018 | 10 | 14 |
| 2019 | 13 | 9 |
| 2020 | 12 | 15 |
| 2021 | 7 | 14 |
| 2022 | 12 | 5 |
| 2023 | 5 | 8 |
| 2024 | 4 | 12 |
| 2025 | 6 | 9 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension2 Dec 2025US 12,490,371 B2
- Lead frame and manufacturing method thereof5 Aug 2025US 12,381,136 B2Dai Nippon Printing Co.Ltd.
- Component Carrier with Different Line Spacing in Metal Traces, and Manufacture Method9 Jul 2026US 2026/0197938 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Copper foil having patterned roughness nodules22 Jan 2026US 2026/0025909 A1Dell Products L. P.
- Copper foil for printed circuit boards and manufacturing method thereof27 Nov 2025US 2025/0361641 A1Nan Ya Plastics Corporation
- Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same27 Nov 2025US 2025/0365863 A1Lotte Energy Materials Corporation
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil23 Oct 2025US 2025/0327203 A1Fukuda Metal Foil & Power Co., Ltd.
Most cited
By later US patents
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Carrier for testing an unpackaged semiconductor die215US 5,541,525 AMicron Technology, Inc. · 1996
- Process for manufacturing a semiconductor package with bi-substrate die214US 5,946,553 AMicron Technology, Inc. · 1999
- Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die212US 5,408,190 AMicron Technology, Inc. · 1995