Carrier for testing an unpackaged semiconductor die

A carrier for testing an unpackaged semiconductor die, comprising:

• a carrier base having a cavity;
• a plate with a support surface, said plate adapted for attachment to the base such that the support surface is contained within the cavity;
• an interconnect mountable to the support surface, said interconnect comprising a substrate having a raised contact member adapted to penetrate a contact location on the die, said interconnect further comprising an electrically conductive trace in electrical communication with the contact member and terminating in a contact pad;
• an external retention contact attached to the carrier base and extending into the cavity to abut the contact pad as the plate is attached to the base to retain the interconnect and establish electrical communication between the contact member on the interconnect and test circuitry;
• and
• a force distribution mechanism for biasing the interconnect and die together, said force distribution mechanism including a pressure plate for abutting the die, a bridge plate clipped to the base and a spring sandwiched between the pressure plate and bridge plate for exerting a biasing force on the pressure plate.

A carrier for testing an unpackaged semiconductor die, comprising:

• a base having a cavity;
• a plate with a support surface, said plate adapted for attachment to the base such that the support surface is contained within the cavity;
• an interconnect placed on the support surface, said interconnect including raised contact members formed on a substrate and a pattern of conductive traces in electrical communication with the raised contact members, with the raised contact members adapted to penetrate contact locations on the die and the interconnect interchangeable with a second interconnect adapted to test a second die;
• a plurality of external retention contacts attached to the base and extending into the cavity for contacting and retaining the interconnect on the support surface as the plate is attached to the base and for establishing an electrically conductive path between the circuit traces and test circuitry;
• and
• a force distribution mechanism removably clipped to the base for exerting a biasing force on the die, said force distribution mechanism including a spring sandwiched between a pressure plate that presses against the die and a bridge clamp attached to the base.