G01R 31/2851
Testing of integrated circuits [ic]
Official title: {Testing of integrated circuits [IC] (G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801)}
G01R31/2851 (Testing of integrated circuits [ic]) appears on 10,039 US grants and 9,822 published applications in this corpus.
Search patents in G01R- Granted patents
- 10,039
- Published applications
- 9,822
- Assignees
- 1,960
- Inventors
- 16,862
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 7 | 0 |
| 1978 | 9 | 0 |
| 1979 | 6 | 0 |
| 1980 | 8 | 0 |
| 1981 | 6 | 0 |
| 1982 | 8 | 0 |
| 1983 | 9 | 0 |
| 1984 | 13 | 0 |
| 1985 | 14 | 0 |
| 1986 | 17 | 0 |
| 1987 | 27 | 0 |
| 1988 | 24 | 0 |
| 1989 | 36 | 0 |
| 1990 | 26 | 0 |
| 1991 | 36 | 0 |
| 1992 | 50 | 0 |
| 1993 | 43 | 0 |
| 1994 | 73 | 0 |
| 1995 | 92 | 0 |
| 1996 | 103 | 0 |
| 1997 | 110 | 0 |
| 1998 | 151 | 0 |
| 1999 | 212 | 0 |
| 2000 | 222 | 0 |
| 2001 | 218 | 93 |
| 2002 | 261 | 234 |
| 2003 | 246 | 268 |
| 2004 | 303 | 315 |
| 2005 | 300 | 422 |
| 2006 | 356 | 409 |
| 2007 | 344 | 483 |
| 2008 | 322 | 474 |
| 2009 | 357 | 426 |
| 2010 | 394 | 371 |
| 2011 | 299 | 327 |
| 2012 | 239 | 284 |
| 2013 | 258 | 317 |
| 2014 | 296 | 360 |
| 2015 | 305 | 432 |
| 2016 | 352 | 349 |
| 2017 | 422 | 375 |
| 2018 | 403 | 423 |
| 2019 | 399 | 390 |
| 2020 | 409 | 427 |
| 2021 | 414 | 418 |
| 2022 | 400 | 428 |
| 2023 | 436 | 483 |
| 2024 | 386 | 431 |
| 2025 | 376 | 440 |
| 2026 | 229 | 443 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G01R 31/2886Features relating to contacting the ic under test3,680
- G01R 31/2855Environmental, reliability or burn-in testing3,421
- G01R 31/2884Using dedicated test connectors, test elements or test circuits on the ic1,965
- G01R 31/2893Handling, conveying or loading854
- G01R 31/2853Electrical testing of internal connections or -isolation730
- G01R 31/2894Aspects of quality control [qc]403
- G01R 31/2896Testing of ic packages387
- G01R 31/2882Testing timing characteristics231
All 9 subgroupsShow fewer
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Device inspection apparatus and device inspection method6 Oct 2026US 12,754,233 B2Mitsubishi Electric Corporation
- Testing apparatus for high-rate transmission and reception of signals between device under test and semiconductor testing apparatus29 Sep 2026US 12,748,144 B2Advantest Corporation
- Probe head for loopback testing and methods of forming the same22 Sep 2026US 12,742,795 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Probe station device8 Oct 2026US 2026/0309769 A1Korea Basic Science Institute
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309770 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309771 A1Nanya Technology Corporation
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly532US 6,091,062 AKinetrix, Inc. · 2000
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Correlation of electrical test data with physical defect data433US 6,950,771 B1Xilinx, Inc. · 2005