G01R 31/2884
Using dedicated test connectors, test elements or test circuits on the ic
Official title: {using dedicated test connectors, test elements or test circuits on the IC under test (G01R31/2855 takes precedence)}
G01R31/2884 (Using dedicated test connectors, test elements or test circuits on the ic) appears on 1,965 US grants and 1,817 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,965
- Published applications
- 1,817
- Assignees
- 575
- Inventors
- 3,974
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 10 | 0 |
| 1994 | 20 | 0 |
| 1995 | 31 | 0 |
| 1996 | 24 | 0 |
| 1997 | 30 | 0 |
| 1998 | 30 | 0 |
| 1999 | 54 | 0 |
| 2000 | 39 | 0 |
| 2001 | 44 | 28 |
| 2002 | 38 | 37 |
| 2003 | 48 | 52 |
| 2004 | 60 | 55 |
| 2005 | 63 | 72 |
| 2006 | 64 | 64 |
| 2007 | 58 | 86 |
| 2008 | 59 | 75 |
| 2009 | 61 | 88 |
| 2010 | 72 | 58 |
| 2011 | 65 | 67 |
| 2012 | 47 | 59 |
| 2013 | 54 | 51 |
| 2014 | 54 | 57 |
| 2015 | 56 | 68 |
| 2016 | 60 | 65 |
| 2017 | 89 | 76 |
| 2018 | 87 | 68 |
| 2019 | 75 | 72 |
| 2020 | 76 | 88 |
| 2021 | 81 | 82 |
| 2022 | 77 | 77 |
| 2023 | 94 | 107 |
| 2024 | 81 | 94 |
| 2025 | 71 | 91 |
| 2026 | 51 | 80 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and semiconductor package22 Sep 2026US 12,742,817 B2Samsung Electronics Co., Ltd.
- Fail-safe and high voltage tolerant test control circuitry for an integrated circuit (IC)25 Aug 2026US 12,716,939 B2STMicroelectronics International N. V.
- Probe card for connecting to contact pads configured to act as probe pads of a semiconductor wafer25 Aug 2026US 12,721,112 B2Skyworks Solutions, Inc.
- Thermal test chip with stackable metal based heater and sensor18 Aug 2026US 12,713,918 B2Texas Instruments Incorporated
- Apparatus and test element group4 Aug 2026US 12,699,136 B2Micron Technology, Inc.
- Semiconductor switch with degradation detection8 Oct 2026US 2026/0309774 A1Infineon Technologies AG
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor aging monitoring1 Oct 2026US 2026/0299014 A1Intel Corporation
- Dual mode high speed loopback with voltage level shifting and multiplexing1 Oct 2026US 2026/0299015 A1Advanced Micro Devices, Inc.
- Detecting distributed voltage regulator failures1 Oct 2026US 2026/0299016 A1International Business Machines Corporation
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method for forming contact pins for semiconductor dice and interconnects364US 5,495,667 AMicron Technology, Inc. · 1996
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999