Probe card for connecting to contact pads configured to act as probe pads of a semiconductor wafer

A system having a semiconductor wafer and a probe card for testing or trimming or programming the semiconductor wafer, the system comprising:

• a first die on the semiconductor wafer including a first integrated circuit having at least one trimmable or programmable component, the at least one trimmable or programmable component being configured to be trimmed or permanently altered in response to an electrical signal received with a first conductor;
• a second die on the semiconductor wafer, the second die including a second integrated circuit, and at least one contact pad arranged to allow an electrical connection to be made to the second integrated circuit, the at least one contact pad having a second conductor being additionally electrically connected to the at least one trimmable or programmable component of the first die such that the at least one contact pad of the second die is configured to act as a probe pad;
• a saw street on the semiconductor wafer arranged between the first and second dies, the saw street having a first conductive section wider than, and connected to, the first conductor, and a second conductive section that is wider than and connected to the second conductor, the first conductive section at least partially overlaps the second conductive section;
• and
• the probe card including at least one probe arranged to make electrical contact with the at least one contact pad of the second die.