Semiconductor device and semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorDonguk Park
Life of this patent
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Abstract
Provided is a semiconductor device including a first transmission pad configured to output a data signal; a second transmission pad configured to output a clock signal; a data transmission circuit connected to the first transmission pad and comprising a data driver configured to generate the data signal; a clock transmission circuit connected to the second transmission pad and comprising a clock driver configured to generate the clock signal; a core circuit configured to control the data driver and the clock driver; and at least one buffer, wherein each buffer of the at least one buffer comprises: an input terminal connected to at least one of an output terminal of the data driver and an output terminal of the clock driver; and an output terminal connected to the core circuit.
Claims20
A semiconductor device comprising:
- a first transmission pad configured to output a data signal;
- a second transmission pad configured to output a clock signal;
- a data transmission circuit connected to the first transmission pad and comprising a data driver configured to generate the data signal;
- a clock transmission circuit connected to the second transmission pad and comprising a clock driver configured to generate the clock signal;
- a core circuit configured to control the data driver and the clock driver;
- at least one buffer, wherein each buffer of the at least one buffer comprises:
- an input terminal connected to at least one of an output terminal of the data driver and an output terminal of the clock driver;
- and
- an output terminal connected to the core circuit;
- and
- at least one switch element connected between the output terminal of the data driver or the output terminal of the clock driver and a corresponding one of the first transmission pad and the second transmission pad,
- wherein the input terminal of the at least one buffer is connected to the at least one switch element.
A semiconductor package comprising:
- a first semiconductor device comprising a first transmission pad configured to output a data signal and a second transmission pad configured to output a clock signal;
- a second semiconductor device comprising a first reception pad configured to receive the data signal and a second reception pad configured to receive the clock signal;
- an intermediate substrate on which the first semiconductor device and the second semiconductor device are mounted, wherein the intermediate substrate comprises a redistribution pattern connecting the first transmission pad with the first reception pad and connecting the second transmission pad with the second reception pad;
- and
- a package substrate on which the intermediate substrate is mounted,
- wherein the first semiconductor device comprises:
- a first switch element connected between an output terminal of a data driver configured to output the data signal and the first transmission pad;
- and
- a first buffer connected to the first switch element.
A semiconductor device comprising:
- a reception pad configured to receive a data signal;
- a sense amplifier comprising a first input terminal connected to the reception pad, a second input terminal configured to receive a predetermined reference voltage, an offset cancellation switch connected between the first input terminal and the second input terminal, and an offset cancellation circuit connected to at least one of the first input terminal and the second input terminal;
- and
- a core circuit configured to:
- control the offset cancellation switch,
- control the offset cancellation circuit to output a first offset cancellation code and a second offset cancellation code,
- turn on the offset cancellation switch with the reception pad in a floating state,
- set one of the first offset cancellation code and the second offset cancellation code to a maximum value and set the other one of the first offset cancellation code and the second offset cancellation code to a minimum value, and
- identify whether the sense amplifier is defective.
Dependencies are inferred from the claim text.