G01R 31/2853
Electrical testing of internal connections or -isolation
Official title: {Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections (G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66)}
G01R31/2853 (Electrical testing of internal connections or -isolation) appears on 730 US grants and 668 published applications in this corpus.
Search patents in G01R- Granted patents
- 730
- Published applications
- 668
- Assignees
- 276
- Inventors
- 1,460
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 6 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 16 | 8 |
| 2002 | 16 | 14 |
| 2003 | 24 | 18 |
| 2004 | 24 | 23 |
| 2005 | 26 | 28 |
| 2006 | 29 | 34 |
| 2007 | 20 | 17 |
| 2008 | 26 | 18 |
| 2009 | 23 | 29 |
| 2010 | 18 | 17 |
| 2011 | 19 | 22 |
| 2012 | 15 | 15 |
| 2013 | 13 | 35 |
| 2014 | 23 | 23 |
| 2015 | 27 | 38 |
| 2016 | 34 | 21 |
| 2017 | 30 | 28 |
| 2018 | 25 | 27 |
| 2019 | 24 | 39 |
| 2020 | 46 | 38 |
| 2021 | 34 | 37 |
| 2022 | 36 | 28 |
| 2023 | 37 | 31 |
| 2024 | 26 | 27 |
| 2025 | 21 | 30 |
| 2026 | 12 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High voltage integrated circuit testing interface assembly14 Jul 2026US 12,681,076 B2Texas Instruments Incorporated
- Systems and methods for automated, artificial intelligence based monitoring of, and/or alerting for, digital out of home display units14 Jul 2026US 12,682,798 B1Manufacturing Resources International, Inc.
- Test and repair of interconnects between chips9 Jun 2026US 12,650,459 B2Intel Corporation
- Die-to-die connectivity monitoring2 Jun 2026US 12,644,924 B2Proteantecs Ltd.
- Semiconductor device including through-silicon via (TSV) test device and operating method thereof5 May 2026US 12,622,321 B2Industry-Academic Cooperation Foundation, Yonsei University
- Testing device and method for testing an electronic device17 Sep 2026US 2026/0276701 A1JCET STATS ChipPAC Korea Limited
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate17 Sep 2026US 2026/0276702 A1
- Integrated circuit testing system and method13 Aug 2026US 2026/0235662 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate13 Aug 2026US 2026/0235700 A1
- Via accuracy measurement16 Jul 2026US 2026/0206545 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Structure and method for producing mask-programmed integrated circuits which are pin compatible substitutes for memory-configured logic arrays223US 5,068,603 AXilinx, Inc. · 1991
- High density wafer contacting and test system210US 4,038,599 AInternational Business Machines Corporation · 1977
- Memory circuit for use in hardware emulation system197US 6,732,068 B2Quickturn Design Systems, Inc. · 2004
- Thermally-induced voltage alteration for integrated circuit analysis140US 6,078,183 ASandia Corporation · 2000
- Emulation system with time-multiplexed interconnect117US 5,960,191 AQuickturn Design Systems, Inc. · 1999