Test and repair of interconnects between chips
AssigneeIntel Corporation
InventorsSreejit Chakravarty, Adithya Kashyap, Vijaya Chelli, Micha Shahar, Rakesh Kandula, Dovev Amosi
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AssigneeIntel Corporation
InventorsSreejit Chakravarty, Adithya Kashyap, Vijaya Chelli, Micha Shahar, Rakesh Kandula, Dovev Amosi
Estimating the term…
Embodiments herein relate to a test, repair, and diagnostic solution for chip-to-chip interconnects. In one aspect, on a first chip, a first finite state machine (FSM) is coupled to a set of transmit lanes. To test each transmit lane, one at a time, the first FSM is to apply a first periodic signal to a transmit lane under test and concurrently apply a second periodic signal to other transmit lanes of the set of transmit lanes, where a phase of the first periodic signal is opposite to a phase of the second periodic signal. A comparator compares a detected signal on the lane under test to an expected response. The comparator can be on the first chip, when the first chip is tested alone, or on a second chip, where the two chips are tested together.
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Dependencies are inferred from the claim text.