Method for testing a packaging substrate, and apparatus for testing a packaging substrate

An apparatus for testing a packaging substrate in accordance with the method, comprising:

• placing the packaging substrate (10) on a stage (105) in a vacuum chamber (110);
• testing one or more networks on the packaging substrate in the vacuum chamber with at least one electron beam column;
• and
• discharging the one or more networks while testing the one or more networks.

An apparatus (100) for testing of a packaging substrate (10), comprising:

• a vacuum chamber (110);
• a stage (105) within the vacuum chamber, the stage being configured to support the packaging substrate;
• a charged particle beam column (120) configured to generate an electron beam, the charged particle beam column comprising:
• an objective lens (124) configured to focus the electron beam on the packaging substrate;
• a scanner configured to scan the electron beam to different positions on the packaging substrate;
• and
• an electron detector (140) for detecting signal electrons (113) emitted upon impingement of the electron beam on the packaging substrate;
• the apparatus further comprising:
• an ion source to provide at least one of positive ions and negative charges
• into at least a portion of the vacuum chamber;
• one or more electrodes configured to generate an electric field between one or more electrodes and the packaging substrate, the electric field being configured to accelerate positive ions or negative charges towards the packaging substrate;
• a controller configured to control the density of at least one of positive ions and negative charges in the vacuum chamber during testing;
• and an analysis unit (141) for determining, based on the signal electrons (113), if a first device-to-device electrical interconnect path (20) is defective.