Testing device and method for testing an electronic device

A testing method for testing an electronic device, wherein the electronic device comprises a socket board, a plurality of contact pads on the socket board, and a socket unit mounted on the socket board;

• wherein the plurality of contact pads comprise multiple ground contact pads and a signal contact pad;
• wherein the socket board comprises a reference connector mounted on the socket board;
• wherein the socket unit comprises a socket body and a plurality of contact pins vertically extending through the socket body and each being aligned with and operably connected to one of the plurality of contact pads;
• wherein the testing device is operably connected to the electronic device;
• and wherein the method comprises:
• mounting a SMA probe connector on a lid body to electrically connect a conductive housing of the SMA probe connector with a conductive portion at a center of the lid body and pass a signal probe of the SMA probe connector through an opening formed at a second side of the conductive portion facing away from the plurality of contact pins and an escape groove at a first side of the conductive portion facing towards the plurality of contact pins, such that the signal probe is electrically connected with a contact pin of the socket unit aligned with the signal contact pad;
• connecting the lid body to the socket unit to connect the conductive portion of the lid body with contact pins of the socket unit that are aligned with the ground contact pads, and to accommodate contact pins of the socket unit aligned with the signal contact pad to avoid contact between a contact pin and the conductive portion by the escape groove;
• and
• connecting a first signal cable coupled to the SMA probe connector and a second signal cable coupled to the reference connector of the socket board to a signal measurement instrument, to enable testing of the electronic device by the signal measurement instrument through the testing device.