Die-to-die connectivity monitoring

A non-transitory computer-readable storage medium having stored thereon a computer-readable encoding of a sensor for a multi-IC module, wherein the multi-IC module comprises:

• a first IC comprising a transmitter configured to transmit data signals, and a second IC interconnected to said first IC over an interconnect lane, wherein the sensor is comprised in the second IC, and wherein the sensor comprises:
• an adjustable delay line configured to receive a clock signal associated with the data signals, and to gradually delay the clock signal by applying a plurality of different time durations to the clock signal;
• a first state-element clocked by the gradually delayed clock signal and configured to sample the data signals according to the different time durations applied to the clock signal;
• a second state-element clocked by the clock signal and configured to sample the data signals according to the clock signal;
• a comparison circuit configured to compare an output of the first state-element with an output of the second state-element;
• and
• processing logic configured to:
• set said adjustable delay line to the plurality of time durations, and
• determine reliability of connectivity between the first and second ICs, based at least on a minimal one of the different time durations for which said comparison circuit indicates a difference between the outputs of the first and second state-elements.