G01R 31/2886
Features relating to contacting the ic under test
Official title: {Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06)}
G01R31/2886 (Features relating to contacting the ic under test) appears on 3,680 US grants and 3,695 published applications in this corpus.
Search patents in G01R- Granted patents
- 3,680
- Published applications
- 3,695
- Assignees
- 909
- Inventors
- 6,113
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 7 | 0 |
| 1989 | 12 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 16 | 0 |
| 1993 | 9 | 0 |
| 1994 | 19 | 0 |
| 1995 | 28 | 0 |
| 1996 | 34 | 0 |
| 1997 | 39 | 0 |
| 1998 | 61 | 0 |
| 1999 | 91 | 0 |
| 2000 | 98 | 0 |
| 2001 | 98 | 42 |
| 2002 | 122 | 99 |
| 2003 | 92 | 118 |
| 2004 | 133 | 134 |
| 2005 | 116 | 197 |
| 2006 | 142 | 170 |
| 2007 | 144 | 196 |
| 2008 | 137 | 207 |
| 2009 | 148 | 151 |
| 2010 | 156 | 154 |
| 2011 | 107 | 129 |
| 2012 | 77 | 109 |
| 2013 | 89 | 90 |
| 2014 | 107 | 136 |
| 2015 | 106 | 140 |
| 2016 | 121 | 103 |
| 2017 | 132 | 113 |
| 2018 | 108 | 127 |
| 2019 | 127 | 140 |
| 2020 | 135 | 150 |
| 2021 | 143 | 162 |
| 2022 | 162 | 149 |
| 2023 | 141 | 165 |
| 2024 | 154 | 145 |
| 2025 | 115 | 161 |
| 2026 | 82 | 208 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing a redistribution layer, redistribution layer, integrated circuit and methods for electrically testing and protecting the integrated circuit6 Oct 2026US 12,753,493 B2STMicroelectronics S,r.l.
- Device inspection apparatus and device inspection method6 Oct 2026US 12,754,233 B2Mitsubishi Electric Corporation
- Testing apparatus for high-rate transmission and reception of signals between device under test and semiconductor testing apparatus29 Sep 2026US 12,748,144 B2Advantest Corporation
- Probe head for loopback testing and methods of forming the same22 Sep 2026US 12,742,795 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Dynamic load pull tuner support for on-wafer testing22 Sep 2026US 12,742,818 B1
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe8 Oct 2026US 2026/0309749 A1Kabushiki Kaisha Nihon Micronics
- Method for testing semiconductor structure8 Oct 2026US 2026/0309773 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Conductive probing interface device8 Oct 2026US 2026/0309775 A1International Business Machines Corporation
- Probe apparatus1 Oct 2026US 2026/0298978 A1Kabushiki Kaisha Nihon Micronics
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method and apparatus for integrated wafer handling and testing404US 6,164,894 A2000