Dynamic load pull tuner support for on-wafer testing

A dynamic tuner support arrangement for on-wafer load pull testing comprising:

• a remotely controlled inclined base supporting the tuner, means for correction of planarity misalignment of a wafer probe, and remotely controlled contact of a wafer probe with a DUT on-wafer including automated compensation of a vertical movement of the wafer probe caused by an internal tuner movement (synchronous balancing);
• wherein
• the remotely controlled inclined base has a front segment and a back segment and is mounted on a platform of a wafer probe station,
• and wherein
• the tuner is mounted permanently on the remotely controlled inclined base and comprises a slabline and at least one remotely controlled mobile carriage moving along the slabline and has a protruding test port towards the front segment of the remotely controlled inclined base, said test port being connected directly with a coaxial connector of the wafer probe, which has a standard slope and probe tips with a rotation axis,
• and wherein
• the remotely controlled inclined base is mounted on the platform of the probe station under an angle matching the standard slope of the wafer probe wherein the front segment of the remotely controlled inclined base is connected with the platform at three points:
• a central pivot, a manual height adjustment device on one side, and a counter control on the opposite side, allowing adjustment of probe tip planarization (THETA);
• and wherein
• the back segment of the remotely controlled inclined base is elevated compared with the front segment of the base at remotely controlled adjustable height.