G01R 31/2889
Interfaces
Official title: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)}
G01R31/2889 (Interfaces) appears on 1,024 US grants and 1,192 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,024
- Published applications
- 1,192
- Assignees
- 384
- Inventors
- 2,211
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 13 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 1 |
| 2002 | 9 | 12 |
| 2003 | 6 | 15 |
| 2004 | 19 | 23 |
| 2005 | 21 | 60 |
| 2006 | 43 | 57 |
| 2007 | 46 | 62 |
| 2008 | 40 | 53 |
| 2009 | 35 | 49 |
| 2010 | 55 | 66 |
| 2011 | 35 | 47 |
| 2012 | 34 | 47 |
| 2013 | 35 | 38 |
| 2014 | 38 | 65 |
| 2015 | 51 | 55 |
| 2016 | 50 | 45 |
| 2017 | 51 | 46 |
| 2018 | 46 | 36 |
| 2019 | 43 | 46 |
| 2020 | 46 | 52 |
| 2021 | 43 | 49 |
| 2022 | 48 | 54 |
| 2023 | 52 | 56 |
| 2024 | 58 | 66 |
| 2025 | 37 | 58 |
| 2026 | 33 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Testing apparatus for high-rate transmission and reception of signals between device under test and semiconductor testing apparatus29 Sep 2026US 12,748,144 B2Advantest Corporation
- Probe systems and methods of operating probe systems8 Sep 2026US 12,730,143 B2FormFactor, Inc.
- Manufacturing automatic test equipment and field ambient comparison with silicon lifecycle management support1 Sep 2026US 12,724,065 B1Synopsys, Inc.
- Abbreviated loopback attenuation18 Aug 2026US 12,710,450 B2FormFactor, Inc.
- Testing module and testing method using the same11 Aug 2026US 12,704,541 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Conductive probing interface device8 Oct 2026US 2026/0309775 A1International Business Machines Corporation
- Composite interface substrate for a probe card and methods for forming and operating the same1 Oct 2026US 2026/0299017 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Testing device and method for testing an electronic device17 Sep 2026US 2026/0276701 A1JCET STATS ChipPAC Korea Limited
- Audio bus line fault protection circuitry10 Sep 2026US 2026/0266895 A1Analog Devices International Unlimited Company
- Semiconductor device tester30 Jul 2026US 2026/0219317 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Contact carriers (tiles) for populating larger substrates with spring contacts304US 5,806,181 AFormFactor, Inc. · 1998
- Large contactor with multiple, aligned contactor units174US 6,690,185 B1FormFactor, Inc. · 2004
- Inspection system, inspection method, and method for manufacturing semiconductor device145US 7,112,952 B2Semiconductor Energy Laboratory Co.Ltd. · 2006
- Probe card assembly and kit, and methods of using same139US 6,246,247 B1FormFactor, Inc. · 2001