Inspection system, inspection method, and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device comprising:

• forming a plurality of TFTs over a substrate;
• forming an antenna in an upper portion of the TFT;
• forming an interlayer insulating film over the antenna;
• forming a plurality of chips by forming a protective layer over the interlayer insulating film to cover the antenna;
• supplying a signal or power supply voltage to each of the plurality of chips without contact by overlapping each antenna of the plurality of chips with an inspection electrode with a space therebetween;
• moving the inspection electrode with an arbitrary portion of the antenna or the whole antenna of each of the plurality of chips overlapped with the inspection electrode with a space therebetween;
• conducting an inspection for grasping an operating state of each of the plurality of chips from a voltage of the inspection electrode and a position of the inspection electrode to the plurality of chips;
• separating the substrate of the chips that have been inspected from the TFT and an antenna;
• and
• attaching the TFT and the antenna that have been separated to a support medium.