Mpi Corporation
CHU-PEI CITY, TW· latest recorded location
MPI CORPORATION is named on 133 US grants and 201 published applications in this corpus. Its most frequent classification is G01R (Measuring electric variables).
- Granted patents
- 133
- Published applications
- 201
- Inventors
- 210
- Granted in 2026 so far
- 4
- Most recent grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 2 | 1 |
| 2010 | 4 | 2 |
| 2011 | 0 | 1 |
| 2012 | 1 | 4 |
| 2013 | 1 | 4 |
| 2014 | 3 | 15 |
| 2015 | 6 | 34 |
| 2016 | 22 | 16 |
| 2017 | 19 | 20 |
| 2018 | 14 | 4 |
| 2019 | 7 | 6 |
| 2020 | 4 | 7 |
| 2021 | 9 | 16 |
| 2022 | 14 | 17 |
| 2023 | 10 | 7 |
| 2024 | 9 | 15 |
| 2025 | 4 | 20 |
| 2026 | 4 | 12 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 334 documents
- G01RMeasuring electric variables300
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered23
- H05KPrinted circuits20
- Y10TTechnical subjects covered by former us classification20
- G01NInvestigating or analysing materials by determining their chemical or physical properties16
- G06TImage data processing or generation, in general14
- H04NPictorial communication11
- G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of9
- G02BOptical elements, systems or apparatus9
- G06FComputing and data processing8
Recent patents
- Positioning method and probe system for performing the same, method for operating probe system, and method for utilizing probe system to produce a tested semiconductor device1 Sep 2026US 12,724,042 B2
- Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure therein18 Aug 2026US 12,710,449 B2
- Quick coupling probe head28 Jul 2026US 12,693,312 B2
- Circuit board detection device10 Mar 2026US 12,571,834 B2
- Probe card and manufacturing method thereof25 Nov 2025US 12,480,976 B2
- Fixture device, testing system, and positioning rod for integrated circuit substrate testing8 Oct 2026US 2026/0309747 A1
- Optical probe system and calibration chuck thereof, distance measuring method, method of performing optical testing and electronic device under test23 Jul 2026US 2026/0211030 A1
- Probe system, probe card, probe head and method for testing electronic device under test integrated on a semiconductor wafer, and electronic device tested by the probe card30 Apr 2026US 2026/0118380 A1
- Testing method, probe head, probe card and probe system for micro-bump test and tested device23 Apr 2026US 2026/0110711 A1
- Probe system, probe card, probe head, and probe for testing electronic device under test integrated on a semiconductor wafer, and electronic device tested by the probe card2 Apr 2026US 2026/0092952 A1
Most cited
By later US patents
- Display screen or portion thereof with graphical user interface19US D922,396 S12021 · Design
- Cantilever-type probe card for high frequency application11US 7,595,651 B22009
- Control method of touch display apparatus7US 11,144,198 B22021
- Vertical probe device and supporter used in the same6US 10,119,991 B22018
- High-frequency probe card and transmission line for high-frequency probe card5US 7,683,645 B22010