Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure therein

A guide plate structure of a probe head of a probe system for testing a device under test integrated in a semiconductor wafer, comprising:

• a first guide plate, comprising:
• a pair of first guide holes, for a pair of probes of the probe head to respectively pass through and extend according to a longitudinal development axis, and the pair of first guide holes being configured to slidably accommodate the pair of probes;
• and
• a first extension hole extending from one of the pair of first guide holes to the other, the first extension hole being configured to provide a compensating impedance between the pair of first guide holes, and the compensating impedance being used to improve impedance matching when probing the device under test with the pair of probes so as to reduce a return loss between the probe head and the device under test, wherein:
• there is a joining position between the first extension hole and one of the pair of first guide holes;
• and
• an opening width of the first extension hole at the joining position is smaller than a probe width of the pair of probes, so as to prevent one of the pair of probes from moving into the first extension hole from one of the pair of first guide holes.