Positioning method and probe system for performing the same, method for operating probe system, and method for utilizing probe system to produce a tested semiconductor device

A positioning method for positioning a plurality of probe assemblies with one or more under-test devices that have a plurality of pads, each of the probe assemblies having at least one probe tip corresponding to one of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies, the positioning method comprising:

• setting the under-test device at a first preset temperature, wherein the under-test device is disposed on a chuck that is movable;
• conducting a first positioning step that is of arranging all of the probe assemblies to be in a standby position, wherein the plurality of pads are situated at a predetermined distance below the at least one probe tip along a vertical direction for subsequent contact;
• conducting a second positioning step that is of positioning a first probe tip of the at least one fixed probe assembly according to a first pad of the under-test device, wherein the first pad is to be contacted by the first probe tip of the fixed probe assembly by moving the chuck along the vertical direction;
• conducting a third positioning step that is of positioning a first probe tip of the motorized probe assembly according to a second pad of the under-test device, wherein the second pad is to be contacted by moving the first probe tip of the motorized probe assembly along the vertical direction;
• conducting a fourth positioning step that is of moving the chuck along the vertical direction, so as to enable the first pad to be in physical contact with the first probe tip of the fixed probe assembly;
• and
• subsequently conducting a fifth positioning step that is of moving the at least one motorized probe assembly along the vertical direction, so as to enable the first probe tip of the motorized probe assembly to be in physical contact with the second pad.

A method for operating a probe system to test an under-test device, wherein the under-test device has a plurality of pads, the method comprising:

• providing a probe system, which has a plurality of probe assemblies, each of the probe assemblies having at least one probe tip corresponding to one of the pads for contact, at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies;
• setting the under-test device at a first preset temperature, wherein the under-test device is disposed on a chuck that is movable;
• arranging all of the probe assemblies to be in a standby position, wherein the plurality of pads are situated at a predetermined distance below the at least one probe tip along a vertical direction for subsequent contact;
• positioning a first probe tip of the fixed probe assembly according to a first pad of the under-test device, wherein the first pad is to be contacted by the first probe tip of the fixed probe assembly by moving the chuck along the vertical direction;
• positioning a first probe tip of the motorized probe assembly according to a second pad of the under-test device, wherein the second pad is to be contacted by moving the first probe tip of the motorized probe assembly along the vertical direction;
• moving the chuck along the vertical direction, so as to enable the first pad to be in physical contact with the first probe tip of the fixed probe assembly within a working region;
• and
• subsequently moving the at least one motorized probe assembly along the vertical direction, so as to enable the first probe tip of the motorized probe assembly to be in physical contact with the second pad within the working region.