Probe card and manufacturing method thereof

A probe card, comprising:

• a probe head;
• a first substrate comprising an upper surface comprising a plurality of first contacts;
• a second substrate disposed on the upper surface of the first substrate, wherein the second substrate comprises a lower surface facing the upper surface of the first substrate and comprising a plurality of second contacts electrically connected with the plurality of first contacts respectively, and an upper surface comprising a plurality of fourth contacts electrically connected with the plurality of second contacts respectively;
• a third substrate disposed between the probe head and the second substrate and disposed on the upper surface of the second substrate, wherein the third substrate comprises a lower surface and a side surface;
• the lower surface of the third substrate faces the upper surface of the second substrate and comprises a plurality of third contacts electrically connected with the plurality of the fourth contacts, respectively;
• an insulating component disposed on the upper surface of the second substrate and the lower surface of the third substrate and at an outer side of the third contacts of the third substrate in a way that at least one first through hole, through which an atmosphere is in communication with a space between the second substrate and the third substrate, is left between the second substrate and the third substrate;
• and
• an adhesive member disposed on the upper surface of the second substrate and arranged on at least a part of the side surface of the third substrate, wherein the adhesive member is disposed at an outer side of the insulating component.