Probe system, probe card, probe head, and probe for testing electronic device under test integrated on a semiconductor wafer, and electronic device tested by the probe card

A probe for physically contacting an electronic device under test, comprising:

• a probe tip configured to contact a corresponding pad of the electronic device under test during testing;
• a probe tail disposed opposite to the probe tip;
• and
• a probe body located between the probe tip and the probe tail and extending along a longitudinal axis, wherein:
• the probe body comprises a first slit extending along the longitudinal axis such that the probe body has two probe arms separated by the first slit;
• a transverse cross-section of the probe body perpendicular to the longitudinal axis has a width side and a thickness side, and the two probe arms are arranged along the width side;
• and
• each of the two probe arms has a bump structure within the first slit, thereby forming two bump structures that face each other within the first slit.