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US 2026/0309775 A1Published application
Conductive probing interface device
AssigneeInternational Business Machines Corporation
InventorsMark Christopher Johnson, Theodore M. Levin, David Michael Audette, Grant Wagner
Life of this patent
Estimating the term…
Abstract
A probing tool apparatus to protect substrate pads on a substrate includes a frame. Conductive input points are on the frame. An elastic element is coupled to the frame. Contact probe pads are coupled to the elastic element and connected to the one or more conductive input points. The contact probe pads are positioned to be aligned with one or more of the substrate pads of a substrate.
Claims20
A probing tool apparatus, comprising:
- a frame;
- one or more conductive input points on the frame;
- an elastic element coupled to the frame;
- and
- one or more contact probe pads coupled to the elastic element and connected to the one or more conductive input points,
- wherein the one or more contact probe pads are arranged to be aligned with a plurality of substrate pads of a semiconductor substrate.
3 more elements
A probing tool apparatus, comprising:
- a probe card;
- a plurality of probe pins coupled to the probe card, wherein the plurality of probe pins are arranged to be able to be aligned with a plurality of substrate pads of a substrate;
- a conductive interface device configured for placement between the plurality of probe pins and the plurality of the substrate pads;
- and
- a plurality of conductive contact probe pads in the conductive interface device, wherein a substrate facing side of the plurality of conductive contact probe pads is positioned to contact the plurality of the substrate pads and a probe card side of the plurality of conductive contact probe pads is positioned to interface with the plurality of probe pins.
2 more elements
A method of protecting pads on a substrate during a probing session, comprising:
- removing a layer of oxide from a top surface of the pads on the substrate;
- positioning a conductive interface device, including one or more conductive contact probe pads, in alignment with the pads on the substrate;
- coupling a probe card including one or more probe pins to the conductive interface device, wherein the conductive interface device is positioned in between the probe card and the pads on the substrate;
- moving the probe card into a probing position with the pads on the substrate;
- contacting the one or more conductive contact probe pads with the probe pins from a first side of the one or more conductive contact probe pads;
- and
- contacting the pads on the substrate with the layer of oxide removed, with the one or more conductive contact probe pads, from a second side of the one or more conductive contact probe pads.
4 more elements
Dependencies are inferred from the claim text.