Method and apparatus for integrated wafer handling and testing
OwnerDavid Chenginventor
Life of this patent
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Abstract
A wafer handling and testing apparatus and method include a station for supporting a wafer carrier, such as a cassette or pod, that holds one or more wafers, where the carrier can be moved in a z-direction. A wafer handling assembly is moveable in an x-direction and removes a wafer from the wafer carrier. The handling assembly includes an end effector and a sensor for detecting an edge of the wafer. A chuck includes a platform that is movable in a z-direction and is used to lift the wafer from the handling assembly and rotate the wafer so that the sensor maps the edge of the wafer. The wafer is then centered on the platform, lowered onto the chuck, and is tested by a test head that is preferably coupled to the handling assembly.
Claims16
An integrated wafer handling and testing apparatus comprising:
- a) a wafer handling assembly moveable as a unit in an x-y plane and which removes a wafer from a wafer carrier, said wafer handling assembly including:
- i) a support arm;
- ii) an end effector, coupled to said support arm, for supporting said wafer;
- and
- iii) a sensor, coupled to said support arm, for detecting an edge of said wafer;
- b) a chuck including a platform, said platform operative to move in a z-direction approximately perpendicular to a surface of said platform, wherein said wafer is transportable to said platform from said wafer handling assembly and to said wafer handling assembly from said platform;
- and
- c) a test head that contacts said wafer while said wafer is on said chuck.
An apparatus as recited in claim I wherein said platform is lowered and said wafer rests on said chuck when said test head contacts said wafer.
Dependencies are inferred from the claim text.