G01R 31/2891
Related to sensing or controlling of force, position, temperature
Official title: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)}
G01R31/2891 (Related to sensing or controlling of force, position, temperature) appears on 898 US grants and 1,013 published applications in this corpus.
Search patents in G01R- Granted patents
- 898
- Published applications
- 1,013
- Assignees
- 315
- Inventors
- 1,846
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 1 |
| 2002 | 9 | 13 |
| 2003 | 17 | 22 |
| 2004 | 17 | 19 |
| 2005 | 18 | 40 |
| 2006 | 34 | 41 |
| 2007 | 33 | 60 |
| 2008 | 39 | 63 |
| 2009 | 47 | 56 |
| 2010 | 50 | 47 |
| 2011 | 36 | 35 |
| 2012 | 18 | 27 |
| 2013 | 34 | 28 |
| 2014 | 32 | 30 |
| 2015 | 25 | 42 |
| 2016 | 33 | 35 |
| 2017 | 42 | 38 |
| 2018 | 40 | 46 |
| 2019 | 40 | 37 |
| 2020 | 44 | 51 |
| 2021 | 50 | 48 |
| 2022 | 56 | 46 |
| 2023 | 47 | 50 |
| 2024 | 40 | 38 |
| 2025 | 33 | 49 |
| 2026 | 18 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer test cassette, wafer test system and wafer test method1 Sep 2026US 12,724,064 B2Xingr Technologies (Zhejiang) Limited
- Handler with cooling head and double-sided fin structure28 Jul 2026US 12,693,332 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for estimating battery cell surface temperature28 Jul 2026US 12,695,127 B2LG Energy Solution, Ltd.
- Planarity control for load pull tuner on wafer14 Jul 2026US 12,681,079 B1
- Voice coil leaf spring prober23 Jun 2026US 12,663,466 B2MACOM Technology Solutions Holdings, Inc.
- Testing device and method for testing an electronic device17 Sep 2026US 2026/0276701 A1JCET STATS ChipPAC Korea Limited
- Transfer system and transfer method10 Sep 2026US 2026/0266898 A1Tokyo Electron Limited
- Test method, correction amount calculation method, and test device3 Sep 2026US 2026/0259257 A1Tokyo Electron Limited
- Moving Device, Inspection Device, and Moving Method27 Aug 2026US 2026/0251703 A1Tokyo Electron Limited
- Probe support assembly including a piezoelectric sensor array for alignment of a probe card assembly and methods of operating and forming the same27 Aug 2026US 2026/0251704 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Large contactor with multiple, aligned contactor units174US 6,690,185 B1FormFactor, Inc. · 2004
- Test fixture alignment system for printed circuit boards166US 5,408,189 AEverett Charles Technologies, Inc. · 1995
- Probe apparatus with tilt correction mechanisms156US 5,804,983 ATokyo Electron Limited · 1998
- Dry interface thermal chuck temperature control system for semiconductor wafer testing144US 5,001,423 AInternational Business Machines Corporation · 1991
- IC test equipment138US 5,172,049 AAdvantest Corporation · 1992