Handler with cooling head and double-sided fin structure

A system, comprising:

• a semiconductor package handler including:
• an end effector structure including a first side and a second side opposite to the first side, the end effector structure includes a first guide structure, and the first side of the end effector structure is configured to, in operation, engage with a semiconductor package to be tested;
• a first thermal interface material coupled to the second side of the end effector structure;
• a heater pad coupled to the first thermal interface material;
• a second thermal interface material coupled to the heater pad;
• and
• a fin structure coupled to the second thermal interface material, the fin structure including:
• a third side that is coupled to the second thermal interface material;
• a fourth side opposite to the third side and facing away from the second thermal interface material;
• a plurality of fins at the third side and protruding from the third side into the second thermal interface material;
• a plurality of recesses at the third side, the plurality of recesses are at partially delimited by the plurality of fins, the plurality of recesses being filled with the second thermal interface material;
• and
• a plurality of pillars at the fourth side and protruding from the fourth side;
• and
• a testing structure including:
• a socket base including a second guide structure, the second guide structure is configured to, in operation, engage with the first guide structure of the end effector structure;
• and
• one or more conductive testing structures configured to, in operation, be in electrical communication with one or more conductive structures of the semiconductor package, and the one or more conductive testing structures are configured to, in operation, provide an electrical pathway to the one or more conductive structures of the semiconductor package to test electrical structures and connections of the semiconductor package.

A fin structure configured to be utilized within a semiconductor package handler, comprising:

• a first side;
• a second side opposite to the first side;
• a plurality of fins at the first side and protruding from the first side, the plurality of fins are configured to be inserted into a thermal interface material;
• a plurality of recesses at the first side, the plurality of recesses are at least partially delimited by the plurality of fins, and the plurality of recesses are filled with the thermal interface material;
• and
• a plurality of pillars at the second side and protruding from the second side, the plurality of pillars being configured to be exposed to a coolant to dissipate heat from the plurality of pillars.