IC test equipment
AssigneeAdvantest Corporation
InventorsToshiyuki Kiyokawa, Hisao Hayama
Life of this patent
Estimating the term…
Abstract
In IC test equipment in which an IC element sucked by an air chuck is carried in the horizontal direction by an X-Y transport unit and the air chuck is lowered toward a test head to load the IC element onto a socket provided on a performance board for test, the socket has a contact housing room defined by a bottom panel and a surrounding wall raised about the periphery thereof, in which spring contacts are arranged, and a planar heat cap made of metal is placed on the socket. In a hole made in the heat cap there are buried a heater and a temperature sensor. The heat cap has a centrally-disposed through hole for receiving the IC element. The through hole is closed to shield the contact housing room from the outside when the air chuck is brought down to the socket.
Claims5
IC test equipment, including an X-Y carrier head, in which an IC element to be tested is thermally stressed, as predetermined, on a hot plate, said IC test equipment comprising:
- sucking means for sucking up the IC element from the hot plate, said sucking means mounted on said X-Y carrier head and provided with heating means;
- socket means for receiving the IC element from the X-Y carrier head on a performance board mounted on a test head, said test head testing the operation of the IC element, said socket means including;
- a socket comprising:
- a bottom panel of an insulating material, for arranging thereon spring contacts which elastically contact terminals of the IC element and a surrounding wall raised about the periphery of said bottom panel to surround the arrangement of said spring contacts;
- and
- a heat cap made of metal and mounted on said socket, said heat cap resting on said surrounding wall in a manner to cover an upper opening of said socket defined by said surrounding wall, said heat cap having a centrally-disposed through hole for receiving the IC element;
- heater means buried in said heat cap, for heating said heat cap;
- and
- temperature sensor means buried in said heat cap, for detecting the temperature of said heat cap;
- the lower end portion of said sucking means shaped to substantially fill said through hole in said heat cap sot hat a substantially shielded room housing the IC element is formed when said sucking means is lowered to load the IC element on said socket.
Dependencies are inferred from the claim text.