Test method, correction amount calculation method, and test device
AssigneeTokyo Electron Limited
InventorShinjiro WATANABE
Life of this patent
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Abstract
A test method includes a step of calculating a correction amount in a three-dimensional direction that is used when a mounting table on which a substrate is mounted is moved in the three-dimensional direction before an electrical test is performed; and a step of moving the mounting table based on the calculated correction amount in the three-dimensional direction when the electrical test is performed. The step of calculating the correction amount in the three-dimensional direction includes acquiring information on a contact state in which the plurality of probes are in contact with the substrate while the mounting table is raised, and calculating the correction amount in the three-dimensional direction based on the acquired information on the contact state.
Claims13
A test method of performing an electrical test by bringing a substrate into contact with a plurality of probes, the test method comprising:
- calculating a correction amount in a three-dimensional direction that is used when a mounting table on which a substrate is mounted is moved in the three-dimensional direction, before the electrical test is performed;
- and
- moving the mounting table based on the calculated correction amount in the three-dimensional direction when the electrical test is performed,
- wherein the calculating of the correction amount in the three-dimensional direction includes:
- acquiring information on a contact state in which the plurality of probes are in contact with the substrate while the mounting table is raised:
- and
- calculating the correction amount in the three-dimensional direction based on the acquired information on the contact state.
A correction amount calculation method of correcting a movement amount of a mounting table on which a substrate is mounted in a three-dimensional direction when an electrical test is performed by bringing the substrate into contact with a plurality of probes, the correction amount calculation method comprising:
- acquiring information on a contact state in which the plurality of probes are in contact with the substrate while the mounting table is raised;
- and
- calculating a correction amount in the three-dimensional direction based on the acquired information on the contact state.
A test device of performing an electrical test of a substrate, the test device comprising:
- a plurality of probes configured to perform the electrical test upon contact with the substrate;
- a mounting table configured to mount the substrate;
- and
- a controller configured to control an operation of the mounting table,
- wherein the controller performs:
- a process of calculating a correction amount in a three-dimensional direction that is used when the mounting table is moved in the three-dimensional direction, before the electrical test is performed;
- and
- a process of moving the mounting stage based on the calculated correction amount in the three-dimensional direction when the electrical test is performed, and
- wherein the process of calculating the correction amount in the three-dimensional direction includes:
- acquiring information on a contact state in which the plurality of probes are in contact with the substrate while the stage is raised;
- and
- calculating the correction amount in the three-dimensional direction based on the acquired information on the contact state.
Dependencies are inferred from the claim text.