Probe mounting structure and reliability test system for wafer-level reliability test

A probe mounting structure for a wafer-level reliability test, comprising a probe mounting plate and a soft insulating sealing plate, wherein:

• the probe mounting plate is provided with a plurality of mounting holes penetrating through a thickness direction of the probe mounting plate;
• a volume of each mounting hole of the plurality of mounting holes is smaller than a preset value, and the mounting hole is used to install a corresponding probe;
• two ends of each probe are respectively connected to a corresponding first pad on a test circuit board and a corresponding die of a wafer under test;
• two sides of the probe mounting plate are in proximity to the test circuit board and the wafer under test respectively, such that each of the plurality of mounting holes forms a sealed chamber;
• the plurality of mounting holes is filled with high-pressure gas to ensure that the wafer under test does not spark during high-voltage testing;
• two sides of the soft insulating sealing plate are respectively attached to the wafer under test and a side of the probe mounting plate away from the test circuit board;
• and
• the insulating sealing plate is provided with a plurality of through holes, and the plurality of through holes has a one-to-one correspondence to the plurality of mounting holes, such that one end of one probe passes through a corresponding one of the plurality of through holes and is in contact with a corresponding die of the wafer under test.

A wafer-level reliability test system, comprising a test machine, a test circuit board, probes, and a probe mounting structure including a probe mounting plate, wherein:

• the test machine is electrically connected to the test circuit board, the probe mounting structure is arranged adjacent to and below the test circuit board, and the probes are arranged in the probe mounting plate;
• the probe mounting plate is provided with a plurality of mounting holes penetrating through a thickness direction of the probe mounting plate;
• a volume of each mounting hole of the plurality of mounting holes is smaller than a preset value, the mounting hole is used to install one corresponding probe, and two opposite end portions of the corresponding probe are both arranged inside the mounting hole;
• two opposite end portions of each probe are respectively connected to a corresponding first pad on the test circuit board and a corresponding die of a wafer under test;
• two sides of the probe mounting plate are in proximity to the test circuit board and the wafer under test respectively, such that each of the plurality of mounting holes forms a sealed chamber;
• the plurality of mounting holes is filled with high-pressure gas to ensure that the wafer under test does not spark during high-voltage testing;
• the test machine is used to provide high-voltage power for testing;
• the test circuit board also includes a plurality of second pads, wherein each of the plurality of second pads is connected to one corresponding first pad through circuits on the test circuit board, and each of the plurality of second pads is also connected to the test machine for receiving the high-voltage power from the test machine;
• and
• the wafer under test is also connected to the test machine to form a test loop and the test machine is also used to determine test results of the wafer under test based on current in the test loop.