G01R 31/2894
Aspects of quality control [qc]
Official title: {Aspects of quality control [QC] (G01R31/31718 takes precedence; program control for QC G05B19/41875)}
G01R31/2894 (Aspects of quality control [qc]) appears on 403 US grants and 440 published applications in this corpus.
Search patents in G01R- Granted patents
- 403
- Published applications
- 440
- Assignees
- 199
- Inventors
- 1,052
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 8 | 4 |
| 2003 | 7 | 8 |
| 2004 | 11 | 12 |
| 2005 | 8 | 15 |
| 2006 | 21 | 26 |
| 2007 | 21 | 29 |
| 2008 | 17 | 22 |
| 2009 | 21 | 27 |
| 2010 | 23 | 21 |
| 2011 | 15 | 24 |
| 2012 | 23 | 14 |
| 2013 | 18 | 17 |
| 2014 | 17 | 19 |
| 2015 | 13 | 27 |
| 2016 | 18 | 17 |
| 2017 | 22 | 12 |
| 2018 | 19 | 25 |
| 2019 | 17 | 21 |
| 2020 | 17 | 16 |
| 2021 | 17 | 12 |
| 2022 | 13 | 21 |
| 2023 | 15 | 19 |
| 2024 | 17 | 12 |
| 2025 | 9 | 14 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method of inspecting a sensor10 Mar 2026US 12,571,839 B2Samsung Display Co., Ltd.
- Manufacturing method of semiconductor package20 Jan 2026US 12,532,711 B2SK hynix Inc.
- Test device, method and system11 Jun 2026US 2026/0160797 A1Nuvoton Technology Corporation
- Test equipment, method and computer readable storage medium11 Jun 2026US 2026/0160800 A1Nuvoton Technology Corporation
- Integrated circuit test platform and integrated circuit test system with material overlap prevention function30 Apr 2026US 2026/0118417 A1Chroma Ate Inc.
- Electronic component test method optimized by a learning algorithm26 Feb 2026US 2026/0056248 A1Bealach Na Bo Finne Teoranta
- Die level testing of vias systems and methods19 Feb 2026US 2026/0050029 A1pSemi Corporation
Most cited
By later US patents
- Correlation of electrical test data with physical defect data433US 6,950,771 B1Xilinx, Inc. · 2005
- Methods and systems for predicting IC chip yield182US 6,751,519 B1KLA-Tencor Technologies Corporation · 2004
- Integrated defect yield management and query system115US 6,314,379 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2001
- Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station106US 6,396,296 B1Advanced Micro Devices, Inc. · 2002
- Method for making a pre-testable semiconductor die package105US 4,801,561 ANational Semiconductor Corporation · 1989