Manufacturing method of semiconductor package
AssigneeSK hynix Inc.
InventorsYoung Chan Oh, Hee Jong Kang, Young Mok Bae
Life of this patent
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Abstract
A method of manufacturing a semiconductor package includes manufacturing dies on each of wafers, testing the wafers including the dies, calculating total scores for the wafers according to results of the tests, and setting reference values corresponding to semiconductor products. The method also includes classifying, as the semiconductor product, a selected wafer having a total score corresponding to a selected reference value among the reference values. The method further includes packaging the dies included in the selected wafer.
Claims16
A method of manufacturing a semiconductor package, the method comprising:
- manufacturing dies on each of wafers;
- testing the wafers including the dies;
- calculating total scores for the wafers according to results of the testing;
- setting reference values corresponding to semiconductor products;
- classifying, as the semiconductor product, a selected wafer having a total score corresponding to a selected reference value among the reference values;
- and
- packaging the dies included in the selected wafer,
- wherein, in the testing of the wafers, at least one of an operation test, a bad block test, a die health test, a section map test, a fail bit test, a quadrat weighted sum test, and a convolution neural network test is used with respect to each of the dies.
A method of manufacturing a semiconductor package, the method comprising:
- manufacturing dies on a wafer;
- performing test operations on the dies;
- calculating scores for the dies according to results of the test operations;
- setting a reference range corresponding to a semiconductor product;
- classifying, as the semiconductor product, selected dies having a score included in the reference range;
- and
- packaging the selected dies,
- wherein the test operations include at least two of an operation test, a bad block test, a die health test, a section map test, a fail bit test, a quadrat weighted sum test, and a convolution neural network test performed on each of the dies.
Dependencies are inferred from the claim text.