Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station
AssigneeAdvanced Micro Devices, Inc.
InventorsThomas S. Tarter, Nhon T. Do
Life of this patent
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Abstract
An integrated circuit package test station supports an integrated circuit package under test in a vertical orientation thereby allowing simultaneous access to both sides of the package. Probe assemblies are utilized on both sides of the package to increase the accuracy, efficiency, and simplicity of performing electrical characterization of the IC package. The IC package holder as well as the probe assemblies are adjustably positioned to allow accurate and precise measurements of through-package electrical characteristics. To aid in positioning the test equipment, a dual-display image magnification system is used which provides images from both sides of the IC package simultaneously.
Claims16
An integrated circuit (IC) package test apparatus comprising:
- a first probe assembly configured to electrically probe a first side of an IC package;
- a second probe assembly configured to electrically probe a second side of the IC package;
- and
- a package holder configured to support the IC package in a substantially vertically-oriented position such that the first and second sides of the IC package are simultaneously accessible to the first and second probe assemblies.
A method in an IC package tester comprising the steps:
- supporting an IC package in a substantially vertical orientation, wherein a first and second side of the IC package are simultaneously accessible;
- probing the first side of the IC package;
- probing the second side of the IC package;
- and
- determining an electrical characterization of the package based on the steps of probing the first and second sides of the IC package.
Dependencies are inferred from the claim text.