Test equipment, method and computer readable storage medium

A test method, comprising:

• in a training period:
• receiving a plurality of WAT sample data from a plurality of sample wafers;
• performing a CP operation on the sample wafers to generate a plurality of CP sample data;
• inputting the plurality of WAT sample data and the plurality of CP sample data into a machine learning model, wherein the machine learning model calculates the plurality of WAT sample data and the plurality of CP sample data to generate a correlation,
• in a test period:
• inputting product information and WAT measurement data of a wafer to be tested to the machine learning model,
• wherein:
• the machine learning model determines at least one key parameter from the WAT measurement data according to the correlation,
• the machine learning model adjusts a testing sequence of a plurality of test items according to the key parameter, and
• the wafer to be tested is tested according to the adjusted testing sequence of the plurality of test items.

A computer readable storage media storing a program code, wherein in response to the program code being executed by a test equipment, the program code directs the test equipment to perform steps comprising:

• in a training period:
• receiving a plurality of WAT sample data from a plurality of sample wafers;
• performing a CP operation on the sample wafers to generate a plurality of CP sample data;
• and
• inputting the plurality of WAT sample data and the plurality of CP sample data into a machine learning model, wherein the machine learning model calculates the plurality of WAT sample data and the plurality of CP sample data to generate a correlation, and
• in a test period:
• inputting product information and WAT measurement data of a wafer to be tested to the machine learning model,
• wherein:
• the machine learning model determines at least one key parameter from the WAT measurement data according to the correlation,
• the machine learning model adjusts a testing sequence of a plurality of test items according to the key parameter, and
• the wafer to be tested is tested according to the adjusted testing sequence of the plurality of test items.