G01R 31/2855
Environmental, reliability or burn-in testing
Official title: {Environmental, reliability or burn-in testing}
G01R31/2855 (Environmental, reliability or burn-in testing) appears on 3,421 US grants and 3,434 published applications in this corpus.
Search patents in G01R- Granted patents
- 3,421
- Published applications
- 3,434
- Assignees
- 979
- Inventors
- 6,782
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 9 | 0 |
| 1989 | 12 | 0 |
| 1990 | 14 | 0 |
| 1991 | 11 | 0 |
| 1992 | 21 | 0 |
| 1993 | 18 | 0 |
| 1994 | 27 | 0 |
| 1995 | 31 | 0 |
| 1996 | 43 | 0 |
| 1997 | 35 | 0 |
| 1998 | 43 | 0 |
| 1999 | 65 | 0 |
| 2000 | 64 | 0 |
| 2001 | 55 | 12 |
| 2002 | 73 | 72 |
| 2003 | 63 | 65 |
| 2004 | 73 | 94 |
| 2005 | 91 | 115 |
| 2006 | 104 | 113 |
| 2007 | 96 | 126 |
| 2008 | 77 | 134 |
| 2009 | 109 | 108 |
| 2010 | 105 | 94 |
| 2011 | 72 | 63 |
| 2012 | 58 | 65 |
| 2013 | 49 | 81 |
| 2014 | 76 | 110 |
| 2015 | 78 | 131 |
| 2016 | 103 | 131 |
| 2017 | 132 | 148 |
| 2018 | 158 | 202 |
| 2019 | 170 | 157 |
| 2020 | 176 | 195 |
| 2021 | 186 | 220 |
| 2022 | 201 | 217 |
| 2023 | 227 | 234 |
| 2024 | 189 | 194 |
| 2025 | 186 | 192 |
| 2026 | 96 | 161 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Small device testing using thermesthesiometer22 Sep 2026US 12,742,815 B2SanDisk Technologies LLC
- Test environment control system22 Sep 2026US 12,742,816 B2Yishi Industrial Co., Ltd
- Tamper-aware age sensor15 Sep 2026US 12,736,579 B2Imec Vzw
- Parallel dipole line photo-hall system with temperature gradient stage15 Sep 2026US 12,736,580 B2International Business Machines Corporation
- Probe station device8 Oct 2026US 2026/0309769 A1Korea Basic Science Institute
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309770 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309771 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309772 A1Nanya Technology Corporation
- Method for testing semiconductor structure8 Oct 2026US 2026/0309773 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly532US 6,091,062 AKinetrix, Inc. · 2000
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery295US 5,258,648 AMotorola, Inc. · 1993
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997