G01R 31/2856
Internal circuit aspects
Official title: {Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]}
G01R31/2856 (Internal circuit aspects) appears on 871 US grants and 828 published applications in this corpus.
Search patents in G01R- Granted patents
- 871
- Published applications
- 828
- Assignees
- 328
- Inventors
- 2,052
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 17 | 0 |
| 2000 | 19 | 0 |
| 2001 | 7 | 4 |
| 2002 | 17 | 7 |
| 2003 | 15 | 18 |
| 2004 | 23 | 18 |
| 2005 | 21 | 26 |
| 2006 | 25 | 29 |
| 2007 | 21 | 28 |
| 2008 | 20 | 22 |
| 2009 | 19 | 25 |
| 2010 | 30 | 11 |
| 2011 | 16 | 17 |
| 2012 | 14 | 18 |
| 2013 | 10 | 23 |
| 2014 | 23 | 29 |
| 2015 | 18 | 41 |
| 2016 | 35 | 47 |
| 2017 | 49 | 59 |
| 2018 | 69 | 61 |
| 2019 | 55 | 48 |
| 2020 | 58 | 52 |
| 2021 | 47 | 47 |
| 2022 | 41 | 38 |
| 2023 | 48 | 48 |
| 2024 | 41 | 38 |
| 2025 | 39 | 37 |
| 2026 | 19 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package18 Aug 2026US 12,710,471 B2Yangtze Memory Technologies Co., Ltd.
- Thermal test chip with stackable metal based heater and sensor18 Aug 2026US 12,713,918 B2Texas Instruments Incorporated
- Test signal circuit for testing a radio frequency receiver circuit, a semiconductor chip and a system comprising the test signal circuit23 Jun 2026US 12,663,459 B2Infineon Technologies AG
- Characterizing path margin monitors without the use of scan chains16 Jun 2026US 12,656,391 B2Synopsys, Inc.
- Circuit for detecting defects2 Jun 2026US 12,644,923 B2Samsung Electronics Co., Ltd.
- Test mode controller circuit controlling test functions for charge and discharge controller circuit1 Oct 2026US 2026/0299013 A1Nisshinbo Micro Devices Inc.
- Encoder-based logic built-in self test24 Sep 2026US 2026/0287642 A1QUALCOMM Incorporated
- Low cost on-chip built-in self-test architecture for millimeter wave radio freqency integrated circuit24 Sep 2026US 2026/0291625 A1Samsung Electronics Co., Ltd.
- Electromigration evaluation methodology with consideration of heat dissipating structure effects17 Sep 2026US 2026/0276698 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Global functional module, semiconductor device comprising the same, and method for fabricating the same17 Sep 2026US 2026/0277850 A1Nanya Technology Corporation
Most cited
By later US patents
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals191US 6,043,563 AFormFactor, Inc. · 2000
- Method of making contact tip structures184US 5,864,946 AForm Factor, Inc. · 1999
- Wafer-level test and burn-in, and semiconductor process171US 6,032,356 AFormFactor, Inc. · 2000
- Structure and method for monitoring stress-induced degradation of conductive interconnects167US 7,397,260 B2International Business Machines Corporation · 2008