Semiconductor package
AssigneeYangtze Memory Technologies Co., Ltd.
InventorZhiguo Li
Life of this patent
Estimating the term…
Abstract
According to one aspect of the present disclosure, a semiconductor package is provided. The semiconductor package may include a first semiconductor chip. The semiconductor package may include at least one second semiconductor chip. The semiconductor package may include a switch protection circuit having a first end connected with the first semiconductor chip and a second end connected with each of the at least one second semiconductor chip. When the semiconductor package is undergoing a charged device model (CDM) discharge, the switch protection circuit may be in an off state to disconnect the first semiconductor chip and the second semiconductor chip.
Claims20
A semiconductor package, comprising:
- a first semiconductor chip;
- at least one second semiconductor chip;
- and
- a switch protection circuit having a first end connected with the first semiconductor chip, a second end connected with each of the at least one second semiconductor chip, and a control end configured to receive a control signal for controlling the switch protection circuit to be in an off state or an on state,
- wherein:
- a state of the control signal is determined based on whether a pin of the semiconductor package is undergoing a charged device model (CDM) discharge, the control signal comprises a first state indicating a CDM discharge at the pin and a second state indicating a normal operation of the semiconductor package;
- and
- when the switch protection circuit is fed with the control signal of the first state indicative of a CDM discharge, the switch protection circuit is in an off state to disconnect the first semiconductor chip and the at least one second semiconductor chip.
A semiconductor package, comprising:
- a package housing provided with a first pin that is susceptible to a charged device model (CDM) discharge;
- a first semiconductor chip in the package housing;
- and
- at least one second semiconductor chip in the package housing, each being connected with the first semiconductor chip via a N-type metal oxide semiconductor (NMOS) transistor,
- wherein the NMOS transistor is disposed in the first semiconductor chip or in each of the at least one second semiconductor chip,
- wherein a control end of the NMOS transistor is fed with a control signal for controlling the NMOS transistor to be in an off state or an on state,
- wherein a state of the control signal is determined based on whether the first pin is undergoing the CDM discharge,
- wherein the semiconductor package further comprises a capacitive element having a first end connected with a second end of the NMOS transistor, and a second end connected with a node of one of the first semiconductor chip and the at least one second semiconductor chip, and
- wherein the control end of the NMOS transistor is connected between the second end of the capacitive element and the node.
An integrated circuit (IC) chip, comprising:
- a semiconductor package, comprising:
- a first semiconductor chip;
- at least one second semiconductor chip;
- and
- a switch protection circuit having a first end connected with the first semiconductor chip, a second end connected with each of the at least one second semiconductor chip, and a control end configured to receive a control signal for controlling the switch protection circuit to be in an off state or an on state,
- wherein:
- a state of the control signal is determined based on whether a pin of the semiconductor package is undergoing a charged device model (CDM) discharge, the control signal comprises a first state indicating a CDM discharge at the pin and a second state indicating a normal operation of the semiconductor package;
- and
- when the switch protection circuit is fed with the control signal of the first state indicative of a CDM discharge, the switch protection circuit is in an off state to disconnect the first semiconductor chip and the at least one second semiconductor chip.
Dependencies are inferred from the claim text.