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US 2026/0277850 A1Published application
Global functional module, semiconductor device comprising the same, and method for fabricating the same
AssigneeNanya Technology Corporation
InventorPIN-HSIU HSIEH
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Abstract
The present application discloses a global functional module, a semiconductor device including the global functional module, and a method for fabricating the semiconductor device with the global functional module. The global functional module includes a plurality of first-type interface sub-modules and at least two second-type sub-modules configured to interface with an external logic module.
Claims18
A semiconductor device, comprising:
- a plurality of storage modules;
- and
- a global functional module comprising:
- a plurality of first-type interface sub-modules configured to interface with plurality of storage modules;
- and
- at least two second-type sub-modules configured to interface with an external logic module.
3 more elements
Dependencies are inferred from the claim text.