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US 2026/0276698 A1Published application
Electromigration evaluation methodology with consideration of heat dissipating structure effects
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Ming Chen, Wen-Che Liao, Ming-Hong Hsieh, Chun-Wei Chang, Hsien Yu Tseng
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Abstract
A temperature derating methodology in thermal-aware electromigration (EM) analysis may comprise identifying a heat sensitive structure, a first heat generating structure, and a first heat dissipating structure. The temperature derating methodology comprises adjustments of an evaluation temperature for the heat sensitive structure by adjusting an operation temperature of the first heat generating structure and calculating a temperature increase for the heat sensitive structure.
Claims20
A method for evaluating a heat sensitive structure comprising:
- identifying a heat sensitive structure in an integrated circuit design layout, the heat sensitive structure having a nominal temperature Tnom;
- identifying a first heat generating structure within a thermal coupling distance of the heat sensitive structure;
- identifying a first heat dissipating structure extending through a substrate on which the first heat generating structure is formed;
- adjusting an operating temperature Toph1 of the first heat generating structure as an adjusted operating temperature Toph1′;
- calculating a temperature increase ΔTh1 for the heat sensitive structure induced by thermal coupling to the first heat generating structure at the adjusted operating temperature Toph1′;
- and
- evaluating the heat sensitive structure at an evaluation temperature TE=Tnom+ΔTh1.
4 more elements
A method for evaluating a heat sensitive structure comprising:
- identifying a heat sensitive structure in an integrated circuit design layout, the heat sensitive structure having a nominal temperature Tnom;
- identifying a heat generating structure within a thermal coupling distance of the heat sensitive structure, wherein the heat generating structure includes a number of heat generating elements;
- calculating an operating temperature Toe of each of the heat generating elements;
- calculating an operating temperature Toph of the heat generating structure based on the operating temperature Toe of each of the heat generating elements;
- identifying a number of heat dissipating structures each extending through a substrate on which the heat generating structure is formed;
- in response to identifying the number of heat dissipating structures, adjusting the operating temperature Toph as an adjusted operating temperature Toph′;
- calculating a temperature increase ΔTh1 for the heat sensitive structure induced by thermal coupling to the heat generating structure at the adjusted operating temperature Toph′;
- and
- evaluating the heat sensitive structure at an evaluation temperature TE=Tnom+ΔTh.
6 more elements
A system, comprising:
- a memory having computer-readable instructions stored thereon;
- and
- a processor that executes the computer-readable instructions to:
- identify a heat sensitive structure in an integrated circuit design layout, the heat sensitive structure having a nominal temperature Tnom;
- identify a heat generating structure within a thermal coupling distance of the heat sensitive structure, wherein the heat generating structure includes a number of heat generating elements;
- calculate an operating temperature Toe of each of the heat generating elements;
- calculate an operating temperature Toph of the heat generating structure based on the operating temperature Toe of each of the heat generating elements;
- identify a number of heat dissipating structures each extending through a substrate on which the heat generating structure is formed;
- in response to identifying the number of heat dissipating structures, adjust the operating temperature Toph as an adjusted operating temperature Toph′;
- calculate a temperature increase ΔTh1 for the heat sensitive structure induced by thermal coupling to the heat generating structure at the adjusted operating temperature Toph′;
- and
- evaluate the heat sensitive structure at an evaluation temperature TE=Tnom+ΔTh.
9 more elements
Dependencies are inferred from the claim text.