G01R 31/286
External aspects
Official title: {External aspects, e.g. related to chambers, contacting devices or handlers}
G01R31/286 (External aspects) appears on 1,642 US grants and 1,590 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,642
- Published applications
- 1,590
- Assignees
- 546
- Inventors
- 3,165
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 7 | 0 |
| 1989 | 10 | 0 |
| 1990 | 13 | 0 |
| 1991 | 9 | 0 |
| 1992 | 18 | 0 |
| 1993 | 13 | 0 |
| 1994 | 17 | 0 |
| 1995 | 20 | 0 |
| 1996 | 33 | 0 |
| 1997 | 27 | 0 |
| 1998 | 28 | 0 |
| 1999 | 46 | 0 |
| 2000 | 40 | 0 |
| 2001 | 40 | 8 |
| 2002 | 43 | 48 |
| 2003 | 38 | 45 |
| 2004 | 48 | 64 |
| 2005 | 56 | 64 |
| 2006 | 57 | 64 |
| 2007 | 57 | 65 |
| 2008 | 41 | 73 |
| 2009 | 57 | 52 |
| 2010 | 49 | 41 |
| 2011 | 32 | 24 |
| 2012 | 25 | 25 |
| 2013 | 19 | 25 |
| 2014 | 14 | 39 |
| 2015 | 31 | 37 |
| 2016 | 35 | 42 |
| 2017 | 35 | 42 |
| 2018 | 38 | 70 |
| 2019 | 53 | 60 |
| 2020 | 70 | 91 |
| 2021 | 79 | 119 |
| 2022 | 102 | 110 |
| 2023 | 114 | 120 |
| 2024 | 91 | 91 |
| 2025 | 78 | 90 |
| 2026 | 42 | 81 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Small device testing using thermesthesiometer22 Sep 2026US 12,742,815 B2SanDisk Technologies LLC
- Test environment control system22 Sep 2026US 12,742,816 B2Yishi Industrial Co., Ltd
- Wafer test cassette, wafer test system and wafer test method1 Sep 2026US 12,724,064 B2Xingr Technologies (Zhejiang) Limited
- Test apparatus with test chamber for burn in boards1 Sep 2026US 12,724,066 B2Samsung Electronics Co., Ltd.
- Probe station device8 Oct 2026US 2026/0309769 A1Korea Basic Science Institute
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309770 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309771 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309772 A1Nanya Technology Corporation
- Apparatus for testing electronic semiconductor components1 Oct 2026US 2026/0298900 A1
Most cited
By later US patents
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery295US 5,258,648 AMotorola, Inc. · 1993
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Electric probing-test machine having a cooling system233US 5,084,671 ATokyo Electron Limited · 1992