Apparatus for testing electronic semiconductor components
OwnerUwe BEIERinventor
Life of this patent
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Abstract
An apparatus for testing an electronic semiconductor component which has a sensor layer for detecting a gaseous substance and is formed on a substrate using a test gas. The apparatus has a chamber enclosing an interior in which negative or positive pressure prevails and in which there are arranged a holding device for holding the substrate; and a nozzle for directionally delivering the test gas onto the sensor layer of the electronic semiconductor component formed on the substrate held by the holding device.
Claims16
1-15. (canceled)
An apparatus for testing an electronic semiconductor component which as a sensor layer for detecting a gaseous substance and is formed on a substrate using a test gas, wherein the apparatus has a chamber enclosing an interior in which negative or positive pressure prevails and in which there are arranged
- a holding device for holding the substrate;
- a nozzle for directionally delivering the test gas onto the sensor layer of the electronic semiconductor component formed on the substrate held by the holding device;
- and
- a contacting device for electrically contacting the semiconductor component at its contact surface, wherein the contacting device is spaced apart from the nozzle;
- wherein the contacting device has an opening through which the nozzle is passed and wherein the nozzle has a nozzle body with a nozzle wall which is spaced apart from the opening in the contacting device.
A method for testing an electronic semiconductor component which has a sensor layer for detecting a gaseous substance and is formed on a substrate using a test gas by an apparatus which has a chamber enclosing an interior in which negative or positive pressure prevails, comprising
- positioning a nozzle with respect to the sensor layer of the electronic semiconductor component to enable a directional delivery of the test gas onto the sensor layer, wherein the nozzle is passed through an opening of a contacting device;
- contacting contact surfaces of the electronic semiconductor component by a contacting device;
- and
- outputting a test signal at contact surfaces of the electronic semiconductor component by the contacting device while the test gas is delivered to the sensor layer by a nozzle.
Dependencies are inferred from the claim text.