G01R 31/2863
Contacting devices
Official title: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)}
G01R31/2863 (Contacting devices) appears on 774 US grants and 688 published applications in this corpus.
Search patents in G01R- Granted patents
- 774
- Published applications
- 688
- Assignees
- 301
- Inventors
- 1,439
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 8 | 0 |
| 1994 | 16 | 0 |
| 1995 | 18 | 0 |
| 1996 | 29 | 0 |
| 1997 | 22 | 0 |
| 1998 | 17 | 0 |
| 1999 | 26 | 0 |
| 2000 | 27 | 0 |
| 2001 | 19 | 4 |
| 2002 | 20 | 25 |
| 2003 | 16 | 15 |
| 2004 | 23 | 23 |
| 2005 | 19 | 38 |
| 2006 | 28 | 36 |
| 2007 | 28 | 24 |
| 2008 | 18 | 34 |
| 2009 | 28 | 31 |
| 2010 | 33 | 18 |
| 2011 | 16 | 11 |
| 2012 | 14 | 13 |
| 2013 | 8 | 10 |
| 2014 | 5 | 10 |
| 2015 | 11 | 15 |
| 2016 | 13 | 13 |
| 2017 | 12 | 14 |
| 2018 | 13 | 21 |
| 2019 | 18 | 31 |
| 2020 | 23 | 25 |
| 2021 | 30 | 55 |
| 2022 | 42 | 46 |
| 2023 | 51 | 55 |
| 2024 | 38 | 33 |
| 2025 | 33 | 51 |
| 2026 | 20 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Probe mounting structure and reliability test system for wafer-level reliability test22 Sep 2026US 12,742,814 B2Semight Instruments Co., Ltd
- Wafer test cassette, wafer test system and wafer test method1 Sep 2026US 12,724,064 B2Xingr Technologies (Zhejiang) Limited
- Test device and semiconductor manufacturing apparatus including test device25 Aug 2026US 12,716,938 B2Samsung Electronics Co., Ltd.
- Socket for testing semiconductor device18 Aug 2026US 12,710,446 B2Samsung Electronics Co., Ltd.
- Probe for measuring a signal and a reference signal and method of manufacturing a probe for measuring a signal and a reference signal4 Aug 2026US 12,699,129 B2Rohde & Schwarz GmbH & Co.KG
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309770 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309771 A1Nanya Technology Corporation
- Burn-in board, burn-in apparatus, and burn-in process8 Oct 2026US 2026/0309772 A1Nanya Technology Corporation
- Apparatus for testing electronic semiconductor components1 Oct 2026US 2026/0298900 A1
- Semiconductor socket24 Sep 2026US 2026/0287643 A1United Precision Technologies Co., Ltd.
Most cited
By later US patents
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery295US 5,258,648 AMotorola, Inc. · 1993
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997
- Carrier for testing an unpackaged semiconductor die215US 5,541,525 AMicron Technology, Inc. · 1996