Semiconductor socket

Abstract

To smoothly perform precise alignment between the contacts of a semiconductor package and the contact pieces. In a semiconductor socket for positioning each solder ball arranged in a rectangular parallelepiped-shaped semiconductor package and each corresponding contact piece arranged in a state of being electrically insulated from each other, a through-hole is formed having a guide portion for guiding the semiconductor package into the guide body from the arrangement surface of the solder balls, and a housing portion for accommodating the semiconductor package guided by the guide portions, and the guide portions, include a tapered portion facing each side edge of the arrangement surface and becoming narrower toward the guiding direction of the semiconductor package and a clearance portion facing each corner portion of the arrangement surface.

Dependencies are inferred from the claim text.