Test device and semiconductor manufacturing apparatus including test device

A test layer comprising:

• a main board;
• one or more test devices arranged in a first direction, parallel to an upper surface of the main board, and a second direction, orthogonal to the first direction;
• and
• a power supply connected to the main board, the power supply configured to apply a voltage to each of the one or more test devices,
• wherein each of the one or more test devices includes,
• a test board;
• a connector attached to a lower surface of the test board;
• a heating device on an upper surface of the test board, the heating device configured to emit heat in response to a signal input through the connector;
• a temperature sensor on the upper surface of the test board, the temperature sensor configured to measure a temperature of the heating device;
• and
• a test socket on the upper surface of the test board, the test socket configured to transmit and receive a signal to and from the heating device and the temperature sensor, wherein
• the power supply includes a voltage output circuit configured to apply a voltage to each of the heating devices and a current sensing circuit configured to detect a current determined based on a voltage applied from each of the heating devices, and
• the power supply is configured to adjust a voltage applied to at least one of the heating devices based on the current detected by the current sensing circuit.

A semiconductor manufacturing apparatus comprising:

• a blower through which air is introduced from an external device;
• a duct configured to receive the air from the blower;
• a tester configured to conduct a test using the air supplied from the duct and to accommodate at least one test layer to be tested;
• and
• a controller connected to the blower, the duct, and the tester to control operations of the blower, the duct, and the tester, wherein
• the test layer includes a power supply, a main board, and one or more test devices, and each of the one or more test devices includes a temperature sensor, a heating device, and a test socket,
• the power supply is configured to supply a voltage to the heating device, the heating device is configured to emit heat, and the temperature sensor is configured to measure a temperature of the heating device during a period of time in which the duct supplies the air to the tester, and
• the controller is configured to convert a result of measuring the temperature into a digital signal and to output temperature distribution information according to positions of the one or more test devices through the digital signal.