Burn-in board, burn-in apparatus, and burn-in process

A burn-in process, comprising:

• providing a plurality of devices under test;
• providing a burn-in board comprising:
• a board-substrate comprising a front surface and a back surface;
• a plurality of sockets mounted on the front surface of the board-substrate;
• and
• a wiring system positioned in the board-substrate, electrically connected to the sockets, and configured the plurality of sockets into groups, wherein the groups respectively comprise four sockets arranged in a 2 x 2 square matrix;
• installing the plurality of devices under test on the plurality of sockets;
• placing the burn-in board into a burn-in chamber of a burn-in apparatus and electrically connecting the burn-in board and the burn-in apparatus;
• performing a stress test to the plurality of devices under test;
• providing to and receiving from signals from the plurality of devices under test by a burn-in controller of the burn-in apparatus through the wiring system of the burn-in board;
• and
• recording test results by the burn-in controller of the burn-in apparatus.