G01R 31/2868
Complete testing stations
Official title: {Complete testing stations; systems; procedures; software aspects}
G01R31/2868 (Complete testing stations) appears on 440 US grants and 450 published applications in this corpus.
Search patents in G01R- Granted patents
- 440
- Published applications
- 450
- Assignees
- 204
- Inventors
- 1,031
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 11 | 3 |
| 2002 | 13 | 17 |
| 2003 | 17 | 21 |
| 2004 | 21 | 23 |
| 2005 | 23 | 12 |
| 2006 | 18 | 16 |
| 2007 | 9 | 16 |
| 2008 | 15 | 19 |
| 2009 | 14 | 10 |
| 2010 | 7 | 6 |
| 2011 | 8 | 4 |
| 2012 | 4 | 6 |
| 2013 | 5 | 7 |
| 2014 | 4 | 8 |
| 2015 | 5 | 6 |
| 2016 | 5 | 13 |
| 2017 | 12 | 8 |
| 2018 | 12 | 23 |
| 2019 | 11 | 13 |
| 2020 | 18 | 26 |
| 2021 | 20 | 36 |
| 2022 | 33 | 36 |
| 2023 | 38 | 28 |
| 2024 | 31 | 42 |
| 2025 | 27 | 27 |
| 2026 | 16 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wafer test cassette, wafer test system and wafer test method1 Sep 2026US 12,724,064 B2Xingr Technologies (Zhejiang) Limited
- Test apparatus with test chamber for burn in boards1 Sep 2026US 12,724,066 B2Samsung Electronics Co., Ltd.
- Processing system, management device, and log acquisition method16 Jun 2026US 12,656,389 B2Tokyo Electron Limited
- Method of having good thermal isolation in wafer test cassette26 May 2026US 12,638,497 B2Xingr Technologies (Zhejiang) Limited
- Test system for detecting faults in multiple devices of the same type5 May 2026US 12,618,895 B2NXP B. V.
- Configuration of parallel testing systems24 Sep 2026US 2026/0287644 A1Chroma Ate Inc.
- Method and system for testing the resilience of an electronic device that in use is subjected to periodic deformations17 Sep 2026US 2026/0276699 A1
- Test circuitry for ring amplifier17 Sep 2026US 2026/0276700 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Carrier, inspection system, and inspection method3 Sep 2026US 2026/0259256 A1Tokyo Electron Limited
- Control of an automated test equipment based on temperature13 Aug 2026US 2026/0235661 A1Advantest Corporation
Most cited
By later US patents
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Electric probing-test machine having a cooling system233US 5,084,671 ATokyo Electron Limited · 1992
- Method of temporarily, then permanently, connecting to a semiconductor device126US 5,983,493 AFormFactor, Inc. · 1999
- Test station122US 4,926,118 ASym-Tek Systems, Inc. · 1990
- Process of performing burn-in and parallel functional testing of integrated circuit memories in an environmental chamber118US 4,379,259 ANational Semiconductor Corporation · 1983