G01R 31/2896
Testing of ic packages
Official title: {Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00)}
G01R31/2896 (Testing of ic packages) appears on 387 US grants and 475 published applications in this corpus.
Search patents in G01R- Granted patents
- 387
- Published applications
- 475
- Assignees
- 186
- Inventors
- 1,069
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 1 |
| 2003 | 3 | 3 |
| 2004 | 3 | 3 |
| 2005 | 6 | 14 |
| 2006 | 7 | 12 |
| 2007 | 13 | 12 |
| 2008 | 4 | 6 |
| 2009 | 5 | 4 |
| 2010 | 2 | 4 |
| 2011 | 5 | 8 |
| 2012 | 9 | 6 |
| 2013 | 4 | 5 |
| 2014 | 7 | 12 |
| 2015 | 7 | 17 |
| 2016 | 24 | 30 |
| 2017 | 20 | 21 |
| 2018 | 27 | 21 |
| 2019 | 19 | 33 |
| 2020 | 32 | 37 |
| 2021 | 35 | 33 |
| 2022 | 34 | 32 |
| 2023 | 33 | 41 |
| 2024 | 26 | 33 |
| 2025 | 34 | 52 |
| 2026 | 18 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Physical layer parameter compliance in high speed communication networks8 Sep 2026US 12,730,144 B1Marvell Israel (M. I. S. L.) Ltd.
- Electronic component manufacturing method, manufacturing film, and manufacturing tool25 Aug 2026US 12,721,109 B2Mitsui Chemicals Ict Materia, Inc.
- Thermal test chip with stackable metal based heater and sensor18 Aug 2026US 12,713,918 B2Texas Instruments Incorporated
- Method and apparatus for testing a semiconductor device11 Aug 2026US 12,704,524 B2
- Testing apparatus and method of using the same11 Aug 2026US 12,704,525 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated heater and cold plate for test applications8 Oct 2026US 2026/0313752 A1AEM Singapore Pte. Ltd.
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate17 Sep 2026US 2026/0276702 A1
- Test tool10 Sep 2026US 2026/0266899 A1Elite Semiconductor Microelectronics Technology Inc.
- Interposer, semiconductor package including interposer, and testing method for interposer27 Aug 2026US 2026/0256000 A1Samsung Electronics Co., Ltd.
- Semiconductor package test device with vertically arranged peltier elements20 Aug 2026US 2026/0243820 A1Livingcare Co.,Ltd.
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station106US 6,396,296 B1Advanced Micro Devices, Inc. · 2002
- Method for making a pre-testable semiconductor die package105US 4,801,561 ANational Semiconductor Corporation · 1989
- Leadframe strip having enhanced testability76US 7,008,825 B1Amkor Technology, Inc. · 2006
- Pre-testable semiconductor die package67US 4,701,781 ANational Semiconductor Corporation · 1987