Testing apparatus and method of using the same

A testing apparatus for a semiconductor package, comprising:

• a plurality of testing patterns, embedded in a circuit board, wherein each of the plurality of testing patterns comprises:
• a first conductive line;
• and
• a second conductive line, comprising a main portion and a branch portion connected to the main portion, wherein the first conductive line and the branch portion are connected to the second conductive line at a merged point of the main portion;
• and
• a socket, disposed over and electrically coupled to the plurality of testing patterns, wherein through the socket, a testing signal generated from the controller of the testing module is transmitted to the semiconductor package and a respective signal from the semiconductor package is transmitted to the testing module.

A testing method for a semiconductor package, comprising:

• providing a testing apparatus comprising a plurality of testing patterns embedded in a circuit board and electrically coupled to the semiconductor package and a testing module disposed over the circuit board, electrically coupled to the testing patterns and comprising a controller generating the electric signals for testing the semiconductor package, wherein each of the testing patterns comprises a first conductive line and a second conductive line, comprising a main portion and a branch portion connected to the main portion, wherein the first conductive line is connected to the second conductive line;
• placing the semiconductor package onto the testing apparatus, the semiconductor package comprising a plurality of terminals in contact with the testing apparatus for, through the testing patterns, transmitting a testing signal generated from the controller of the testing module to the semiconductor package and a respective signal from the semiconductor package is transmitted to the testing module;
• and
• performing an automated test sequence on the semiconductor package through the testing apparatus.