Physical layer parameter compliance in high speed communication networks

An apparatus for determining compliance of an integrated circuit (IC) mounted in an IC package using a test fixture, the test fixture including a channel that connects a first test point on the test fixture to a second test point on the test fixture, the first test point on the test fixture corresponding to a contact on the IC package, the apparatus comprising:

• one or more processors;
• and
• a memory storing computer-readable instructions that, when executed by the one or more processors, cause the one or more processors to:
• determine a reference value of a physical layer (PHY) parameter at the second test point on the test fixture, including determining the reference value based on:
• i) one or more model values specified by the Ethernet communication standard, the one or more model values corresponding to the first test point on the test fixture, and
• ii) one or more measured test fixture parameters characterizing the channel connecting the first test point on the test fixture to the second test point on the test fixture in isolation from the IC package, and
• determine whether the PHY parameter of the IC complies with the Ethernet communication standard based on i) the reference value of the PHY parameter at the second test point on the test fixture and ii) a measured value of the PHY parameter of the IC, the measured value obtained from a measurement of the PHY parameter performed at the second test point on the test fixture when the IC package is mounted on the test fixture.

A non-transitory computer-readable medium, or media, storing instructions that, when executed by one or more processors, cause the one or more processors to:

• receive one or more measured test fixture parameters characterizing a channel connecting a first test point on the test fixture to a second test point on a test fixture, the first test point on the test fixture corresponding to a contact on an integrated circuit IC package, the one or more measured test fixture parameters characterizing the channel in isolation from the IC package;
• determine a reference value for a physical layer (PHY) parameter of an IC mounted in the IC package, the reference value corresponding to the second test point on the test fixture, including determining the reference value based on
• i) one or more model values specified by the Ethernet communication standard, the one or more model values corresponding to the first test point on the test fixture, and
• ii) the one or more measured test fixture parameters characterizing the channel connecting the first test point on the test fixture to the second test point on the test fixture in isolation from the IC package;
• and
• determine whether the PHY parameter of the IC complies with the Ethernet communication standard based on i) the reference value of the PHY parameter at the second test point on the test fixture, and ii) a measured value of the PHY parameter of the IC, the measured value obtained from a measurement of the PHY parameter performed at the second test point on the test fixture when the IC package is mounted on the test fixture.