Leadframe strip having enhanced testability

A method of fabricating a semiconductor package, comprising the steps of:

• a) providing a leadframe strip defining a strip plane and a multiplicity of leadframes which each include:
• an outer frame defining a central opening;
• a plurality of support bars which extend within the outer frame along respective ones of first and second leadframe axes;
• a plurality of die pads disposed within the central opening and separated from each other by the support bars;
• and
• a plurality of leads attached to the outer frame and the support bars, the leads extending toward respective ones of the die pads in spaced relation to each other;
• the outer frames being integrally connected to each other and collectively defining connecting bars which extend in multiple rows and columns and define saw streets;
• b) attaching semiconductor dies to respective ones of the die pads of each of the leadframes;
• c) electrically connecting the semiconductor dies of each of the leadframes to respective ones of the leads thereof;
• d) applying an encapsulant material to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes and the semiconductor dies, the leadframe strip and the mold cap collectively defining a package strip;
• e) forming first isolation cuts completely through the package strip along at least some of the saw streets subsequent to forming the at least one mold cap;
• and
• f) forming second isolation cuts through the package strip along at least some of the first and second leadframe axes of each of the leadframes subsequent to forming the at least one mold cap and prior to a singulation of the packaging strip.

A method of fabricating a semiconductor package, comprising the steps of:

• a) providing a leadframe strip defining a strip plane and a multiplicity of leadframes which each include:
• an outer frame defining a central opening;
• a plurality of leads attached to the outer frame and extending into the central opening in spaced relation to each other;
• and
• a die pad disposed within the central opening, the leads attached to the outer frame extending toward the die pad in spaced relation to each other;
• the outer frames being integrally connected to each other and collectively defining connecting bars which extend in multiple rows and columns and define saw streets
• b) attaching semiconductor dies to respective ones of the die pads;
• c) electrically connecting the semiconductor dies to the leads of respective ones of the leadframes;
• d) applying an encapsulant material to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes and the semiconductor dies, the leadframe strip and the mold cap collectively defining a package strip;
• and
• e) forming isolation cuts completely through the package strip along at least some of the saw streets subsequent to forming the at least one mold and prior to a singulation of the packing strip cap.