G01R 31/2893
Handling, conveying or loading
Official title: {Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00)}
G01R31/2893 (Handling, conveying or loading) appears on 854 US grants and 850 published applications in this corpus.
Search patents in G01R- Granted patents
- 854
- Published applications
- 850
- Assignees
- 301
- Inventors
- 1,577
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 10 | 0 |
| 1995 | 5 | 0 |
| 1996 | 10 | 0 |
| 1997 | 11 | 0 |
| 1998 | 17 | 0 |
| 1999 | 23 | 0 |
| 2000 | 20 | 0 |
| 2001 | 17 | 7 |
| 2002 | 22 | 15 |
| 2003 | 9 | 14 |
| 2004 | 19 | 20 |
| 2005 | 22 | 42 |
| 2006 | 22 | 41 |
| 2007 | 35 | 48 |
| 2008 | 31 | 68 |
| 2009 | 37 | 41 |
| 2010 | 40 | 36 |
| 2011 | 22 | 30 |
| 2012 | 22 | 35 |
| 2013 | 31 | 44 |
| 2014 | 23 | 35 |
| 2015 | 33 | 45 |
| 2016 | 34 | 26 |
| 2017 | 37 | 23 |
| 2018 | 28 | 32 |
| 2019 | 29 | 29 |
| 2020 | 30 | 45 |
| 2021 | 40 | 21 |
| 2022 | 32 | 25 |
| 2023 | 24 | 47 |
| 2024 | 36 | 20 |
| 2025 | 24 | 38 |
| 2026 | 16 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dynamic load pull tuner support for on-wafer testing22 Sep 2026US 12,742,818 B1
- Testing system and method thereof15 Sep 2026US 12,736,335 B2Nanya Technology Corporation
- Insert inserted to tray for transporting semiconductor products, tray including the insert, and semiconductor product test system including the insert15 Sep 2026US 12,736,581 B2Ateco Inc.
- Device handling apparatus and device testing apparatus15 Sep 2026US 12,736,582 B2Advantest Corporation
- Substrate including test circuit and substrate test apparatus including the substrate8 Sep 2026US 12,733,460 B2Samsung Electronics Co., Ltd.
- Test handler for electronic component1 Oct 2026US 2026/0299018 A1Mirae Corporation
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate17 Sep 2026US 2026/0276702 A1
- Transfer system and transfer method10 Sep 2026US 2026/0266898 A1Tokyo Electron Limited
- Alignment system in electronic device testing30 Jul 2026US 2026/0219314 A1Delta Design, Inc.
- Semiconductor device tester30 Jul 2026US 2026/0219317 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Carrier for testing an unpackaged semiconductor die215US 5,541,525 AMicron Technology, Inc. · 1996
- Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die212US 5,408,190 AMicron Technology, Inc. · 1995
- Carrier for testing an unpackaged semiconductor die209US 5,519,332 AMicron Technology, Inc. · 1996
- Method for testing semiconductor dice with conventionally sized temporary packages197US 5,815,000 AMicron Technology, Inc. · 1998